4 Layer Half Hole PCB TG150 Material 1.0 MM Thickness
Board Info:
1 Part NO: Half hole PCB0019
2 Layer Count: 4 Layer PCB
3 Finished Board Thickness: 1.0 MM tolerance is +/-0.1MM
4 Solder Mask: Green Solder Mask
5 Min Lind Space&Width: 4/4 mil
6 Application Area: Blue-tooth Module
7 Drillings: L1-L2 0.1MM, L2-L3 0.15MM, L3-L4 0.1MM, L1-L4 0.2MM Mechanical Drilling
8 PCB Size: 105.95mm*83mm/30pcs
9 Material: S1150G
Packing Specifications:
1 One vacuum pcb package should not be over 25 panels based on panel size.
2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.
3 The pcb package must be suitable to ensure effective vacuum sealing.
4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.
5 Humidity indicator card target less than 10%.
X-OUT per panel:
1 X-OUT panel must be packed separately and marked clearly
2 A black X must be permanently marked on both sides of pcb
3 X-OUT per panel not be over 25%
4 X-OUT per lot not be over 5%
Requirement:
1 All dimensions are in MM.
2 Fabricate per IPC-6012A Class2.
3 Materials:
3.1 Dielectric: FR4 Per IPC or equivalent
3.2 Min Tg: 170DEG
3.3 Copper: As per stack up
3.4 UL Rating: 94V0 Minimum
4 Surface finish: ENIG
5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed.
6 Editing of existing copper layers shall require customer approval.
7 Silkscreen legend to be applied per layer stackup using white non-conductitive epoxy ink.
8 100% continuity testing using database netlist shall be performed.Vendor to identify test passed in secondary side.
9 Vendor to mark date code and logo in legend secondary side.
10 Bow and twist shall not exceed 1.0% of longest side.
11 Vendor to provide panel drawing for customer approval before production
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4 Layer Half Hole PCB TG150 Material 1.0 MM Thickness Images
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