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8 Layer HDI Blind Buried Half Hole PCB 1.0 MM Thickness

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8 Layer HDI Blind Buried Half Hole PCB 1.0 MM Thickness

Brand Name : WITGAIN PCB

Model Number : Half hole PCB0017

Certification : UL

Place of Origin : China

MOQ : 1 pcs/lot

Price : negotiable

Payment Terms : T/T

Supply Ability : 100k pcs/month

Delivery Time : 20 days

Packaging Details : Vacuum bubble bag packaging

Material : FR4 TG>170

No of layers : 8 Layer

PCB Kind : HDI PCB

PCB Thickness : 1.0 MM

Surface technics : Immersion Gold 2U'

Min Lind Space&Width : 3/3 mil

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8 Layer HDI PCB Half Hole Blind And Buried Holes 1.0 MM Thickness

Board Info:

1 Part NO: Half hole PCB0017


2 Layer Count: 8 Layer PCB


3 Finished Board Thickness: 1.0 MM tolerance is +/-0.1MM


4 Solder Mask: Green


5 Min Lind Space&Width: 3/3 mil


6 Application Area: GPS Module

7 Drilling: L1-L2 0.1MM, L2-L3 0.1MM, L3-L6 0.15MM, L6-L7 0.1MM, L7-L8 0.1MM, L1-L2 0.2MM Blind and Buried Holes

Our Capabilities:

NO Item Capability
1 Layer Count 1-24 Layers
2 Board Thickness 0.1mm-6.0mm
3 Finished Board Max Size 700mm*800mm
4 Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
5 Warp <0.7%
6 Major CCL Brand KB/NanYa/ITEQ/ShengYi/Rogers Etc
7 Material Type FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
8 Drill Hole Diameter 0.1mm-6.5mm
9 Out Layer Copper Thickness 1/2OZ-8OZ
10 Inner Layer Copper Thickness 1/3OZ-6OZ
11 Aspect Ratio 10:1
12 PTH Hole Tolerance +/-3mil
13 NPTH Hole Tolerance +/-1mil
14 Copper Thickness of PTH Wall >10mil(25um)
15 Line Width And Space 2/2mil
16 Min Solder Mask Bridge 2.5mil
17 Solder Mask Alignment Tolerance +/-2mil
18 Dimension Tolerance +/-4mil
19 Max Gold Thickness 200u'(0.2mil)
20 Thermal Shock 288℃, 10s, 3 times
21 Impedance Control +/-10%
22 Test Capability PAD Size min 0.1mm
23 Min BGA 7mil
24 Surface Treatment OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc

S1000-2 Data Sheet:

S1000-2
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC ℃ 180
IPC-TM-650 2.4.24.4 DMA ℃ 185
Td IPC-TM-650 2.4.24.6 5% wt. loss ℃ 345
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 2.4.24.1 TMA min 60
T288 IPC-TM-650 2.4.24.1 TMA min 20
T300 IPC-TM-650 2.4.24.1 TMA min 5
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- 100S No Delamination
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 2.2 x 108
E-24/125 MΩ.cm 4.5 x 106
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ 7.9 x 107
E-24/125 MΩ 1.7 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 100
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 63
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.8
IEC 61189-2-721 10GHz -- —
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.013
IEC 61189-2-721 10GHz -- —
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm —
After thermal Stress 288℃,10s N/mm 1.38
125℃ N/mm 1.07
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 562
CW IPC-TM-650 2.4.4 A MPa 518
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

Product Tags:

HDI Half Hole PCB

      

8 Layer Half Hole PCB

      

Buried Hole PCB

      
Quality 8 Layer HDI Blind Buried Half Hole PCB 1.0 MM Thickness for sale

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