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8 Layer Multilayer Circuit Board Red Solder Printed 50 Ohm

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Name: 8 Layer Multilayer Circuit Board Red Solder Printed 50 Ohm
Brand: WITGAIN PCB
Price: 1 USD

Brand Name : WITGAIN PCB

Model Number : Multi-Layer PCB0026

Certification : UL

Place of Origin : China

MOQ : 1 pcs/lot

Price : negotiable

Payment Terms : T/T

Supply Ability : 100k pcs/month

Delivery Time : 20 days

Packaging Details : Vacuum bubble bag packaging

No of layers : 8 layers

Solder Mask : Red Solder Mask

Min Hole Size : 0.2MM

PCB Outline Size : 234.95mm*165.1mm/1pcs

Impedance Control : 50 ohm

Min Lind Space&Width : 4/4 mil

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Multi Layer Circuit Board 8 Layer Printed Circuit Board Red Solder Mask

PCB Specifications:

1 Part NO: Multi-Layer PCB0026

2 Layer Count: 8 Layer PCB

3 Finished Board Thickness: 2.0MM

4 Copper Thickness: 1/1/1/1/1/1 OZ

5 Min Lind Space&Width: 4/4 mil

6 Application Area: Industrial Control

Material Data Sheet:

S1130
Items		Method	Condition	Unit	Typical Value
Tg		IPC-TM-650 2.4.25	DSC	℃	135
Td		IPC-TM-650 2.4.24.6	5% wt. loss	℃	310
CTE (Z-axis)		IPC-TM-650 2.4.24	Before Tg	ppm/℃	65
			After Tg	ppm/℃	310
			50-260℃	%	4.5
T260		IPC-TM-650 2.4.24.1	TMA	min	13
T288		IPC-TM-650 2.4.24.1	TMA	min	<1
Thermal Stress		IPC-TM-650 2.4.13.1	288℃, solder dip	--	60S No Delamination
Volume Resistivity		IPC-TM-650 2.5.17.1	After moisture resistance	MΩ.cm	4.8E + 08
Volume Resistivity		IPC-TM-650 2.5.17.1	E-24/125	MΩ.cm	4.6E + 06
Surface Resistivity		IPC-TM-650 2.5.17.1	After moisture resistance	MΩ	5.2E + 07
Surface Resistivity		IPC-TM-650 2.5.17.1	E-24/125	MΩ	5.3E + 06
Arc Resistance		IPC-TM-650 2.5.1	D-48/50+D-4/23	s	120
Dielectric Breakdown		IPC-TM-650 2.5.6	D-48/50+D-4/23	kV	60
Electrical Strength		IPC-TM-650 2.5.6.2	D-48/50+D-4/23	kV/mm	—
Dissipation Constant (Dk)		IPC-TM-650 2.5.5.9	1MHz	--	4.6
Dissipation Constant (Dk)		IEC 61189-2-721	10GHz	--	—
Dissipation Factor (Df)		IPC-TM-650 2.5.5.9	1MHz	--	0.016
Dissipation Factor (Df)		IEC 61189-2-721	10GHz	--	—
Peel Strength(1oz HTE copper foil)		IPC-TM-650 2.4.8	A	N/mm	—
			After thermal Stress 288℃,10s	N/mm	1.8
			125℃	N/mm	1.6
Flexural Strength	LW	IPC-TM-650 2.4.4	A	MPa	600
Flexural Strength	CW	IPC-TM-650 2.4.4	A	MPa	500
Water Absorption		IPC-TM-650 2.6.2.1	E-1/105+D-24/23	%	0.15
CTI		IEC30112	C-48/23/50,	℃	PLC 3
Flammability		UL94	C-48/23/50	Rating	V-0
Flammability		UL94	E-24/125	Rating	V-0

Our Product Categories:

Our Product Categories
Material Kinds	Layer Counts	Treatments
FR4	Single Layer	HASL Lead Free
CEM-1	2 Layer/Double Layer	OSP
CEM-3	4 Layer	Immersion Gold/ENIG
Aluminum Substrate	6 Layer	Hard Gold Plating
Iron Substrate	8 Layer	Immersion Silver
PTFE	10 Layer	Immersion Tin
PI Polymide	12 Layer	Gold fingers
AL2O3 Ceramic Substrate	14 Layer	Heavy copper up to 8OZ
Rogers, Isola high frequency materials	16 Layer	Half plating holes
Halogen free	18 Layer	HDI Laser drilling
Copper based	20 Layer	Selective immersion gold
	22 Layer	immersion gold +OSP
	24 Layer	Resin filled in vias

Product Tags:

Printed Multilayer Circuit Board

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